The horizontal 6-inch two tube annealing furnace is used for alloy, oxidation, annealing, sintering, diffusion and other processes of 6-inch silicon wafers in large-scale integrated circuit and MEMS production lines. It can also be used for sinking processes to complete the corresponding processes of 4-inch wafers.
1、 Equipment structure:
1. Operation mode: Left (right) hand operation mode
2. Silicon wafer size: 6-inch circular wafer
3. Process layout: meet customer process requirements
4. Automation level: Industrial computer control system automatically controls the process flow
5. Delivery and pickup method: manual entry and exit of the boat.
6. Appearance: One main unit, with a horizontal two tube main frame.
2、 Main technical parameters:
1. Effective diameter of heating furnace tube: suitable for 6-inch silicon wafers. It is compatible with 5-inch and 4-inch silicon wafers downwards.
2. Working temperature range: Upper tube: 600~1400 ℃
Lower tube: 200~500 ℃
3. Constant temperature zone length and accuracy: 600mm,
Upper tube: 800-1400 ℃ ±0.2℃/24h
Lower tube: 200-500 ℃ ±0.2℃/24h
4. Control mode: Unified process management by industrial computer
5. Gas path setting: Two gas paths per tube: nitrogen 100L/min and argon 100L/min. All use MFC to automatically control the flow rate.
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