1、 Equipment usage
The IGBT vacuum welding furnace produced by our company uses vacuum to achieve no hollow solder joints, which can fully meet the needs of the R&D department and is suitable for large-scale production. Mainly for vacuum welding of large-scale cell chips, SMT devices, power electronic devices, IGBT, SRR devices.
2、 Equipment technical specifications
1. Operating temperature: 550 ℃
2. Effective welding area: 405 * 540mm
3. Control accuracy: ± 1 ℃
4. Process gas: nitrogen+hydrogen+acid gas
5. Temperature control instrument: using Japanese Omron high-precision temperature controller
6. Structural form: horizontal (square box), shell sprayed with computer ash
7. Equipment power supply: three-phase four wire AC380V/50HZ 45KW
Pre sales consultant
